The TSI engineering team has just completed a microcontroller-based high precision temperature monitoring and alarm board. This unit is powered by the NXP Kinetis microcontroller and uses a 1-wire interface temperature sensor.
The TSI engineering team has just completed a microcontroller-based high precision temperature monitoring and alarm board. This unit is powered by the NXP Kinetis microcontroller and uses a 1-wire interface temperature sensor.
The TSI Engineering team has just completed an embedded printer circuit board design using the new DIGI SoM ConnectCore 6UL-2. This SoM was selected to replace an older circuit design to provide new technology, more resources, and wireless connectivity. TSI continues to leverage new technology in their clients designs for [read more]
TSI’s sales team will be attending the 2018 EEE&M Show in Maryland Heights, MO on Wednesday, April 11,2018 from 9:00AM – 5:00 PM. See https://erastl.org/show-information/ for more information.